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| =>Conductive Paints |
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This series could be used in the electronic industry by spray,dipping or screen print to form a conductive or solderable coating for electromagnetic shield or electrode of components. |
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 Electromagnetic Shield Paints |
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Basic characteristics
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Subject/
Product NO. |
Shape |
Viscidity (mpas) |
Solid
Content (wt%) |
Drying
Process (hr) |
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CP-1 |
Silver color or light yellow |
0.8~1.2 |
＞40 |
Surface dry:2 Reality dry:24 |
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CP-2 |
Silver color or light yellow |
0.6~1.2 |
＞35 |
Surface dry:2 Reality dry:24 |
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CP-3 |
Silver color or light yellow |
0.6~1.2 |
＞35 |
Surface dry:2 Reality dry:24 |
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Hardness
(H) |
Volume
Resistivety (Ω.cm) |
Shield Effect
(dB) |
Application |
Feature |
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＞4H |
＜2.5*10-4 |
40~75 (10k-35G) |
Spray or dipping |
Rigid substrate,such as ABS |
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＞4H |
＜8.0*10-5 |
40~75 (10k-35G) |
Spray or dipping |
Flexible substrate,such as
PET,PC,P1 |
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＞4H |
＜8.0*10-5 |
40~75 (10k-35G) |
Spray or dipping |
High service temperature |
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*Viscosity data measured by Rion Viscometer
VT-04E(JPAPN),25℃,1#spin-dle,60rpm.Other
drying process:20min room temperature and 60℃/20min,sto-rage:≦40℃,≧6months. |
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Conductive
Paints For Ta-capacitor |
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Basic
characteristics |
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Subject/
Product NO. |
Solid Content
(wt%) |
Viscidity(mpas) |
Dryiny
Process(hr) |
Volume
Resistivety (Ω.cm) |
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TA-1 |
40~50 |
80~120 |
Room temp.dry30min 150℃/30min |
＜2.5*10-4 |
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TA-2 |
35~40 |
80~120 |
Room
temp.dry30min 140℃/30min
180℃/30min |
＜9.0*10-5 |
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TA-3 |
40~50 |
80~120 |
Room emp.dry30min
150℃/30min |
＜2.0*10-4 |
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Dipping Soldering
Condition |
Solder Ability |
TEMP Servece |
Feature |
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Sn62Pb36 Ag2 220℃~230℃
1~5秒 |
Coated area＞95% |
-45~+170℃ |
For dipping-type Ta-capacitor,good
good solder ability |
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-45~+275℃ |
Chip Ta-capacitor,elastic and low ESR |
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Sn96Pb3.5 Ag0.5 220℃~230℃
1~5秒 |
Coated area＞90% |
-45~+275℃ |
Pb-free solder |
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